Chip Packaging and Testing

How computer chips are made

Chapter 1

From beach sand to pure silicon

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Chapter 2

Designing the microscopic city

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Chapter 3

Printing with light in the cleanroom

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Chapter 4

Slicing, packaging, and testing the final chip

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YOUR GOAL

Master of How computer chips are made

Ch 4 · Slicing, packaging, and testing the final chip

Slice, Wrap, Zap!

BETA

steve Slice, Wrap, Zap!

steve Chip Packaging and Testing

Spin the diamond blade, slice the silicon, wire it up and turn the power on.

steve Packaging the delicate silicon for protection

Packaging the delicate silicon for protection

steve The fragile silicon die is enclosed in a protective plastic or ceramic casing with electrical connectors.

Dicing the wafer into individual dies

steve The circular wafer is cut into tiny individual square pieces called dies using high-speed saws.

Fun Fact

Gold connections: The microscopic wires connecting a chip die to its outer package are often made of pure gold.

Gossip

Do you prefer repairable electronics or sleek designs?

Quiz

What happens to chips on a wafer that fail the initial probe test?

steve Dicing the wafer into individual dies

Quiz

What does a wafer prober do during the manufacturing process?

steve Testing the wafer before slicing it up

Quiz

How are logos and model numbers printed onto the final packaged chip?

steve The final test before shipping to devices

Quiz

Why must completed chips undergo thermal testing?

Quiz

What metal is frequently used for the tiny wire bonds connecting the silicon die to the package pins?

Quiz

At what speed does a typical dicing saw spin to cut silicon wafers?

Quiz

What material is most commonly used to seal and protect the final packaged chip?

Quiz

What is an individual, uncut square of silicon on a wafer called?