How computer chips are made

Chapter 1

From beach sand to pure silicon

Chapter 2

Designing the microscopic city

Chapter 3

Printing with light in the cleanroom

Chapter 4

Slicing, packaging, and testing the final chip

Ch 4 · Slicing, packaging, and testing the final chip

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steve Testing the wafer before slicing it up

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Quiz

What is an individual, uncut square of silicon on a wafer called?

Jul 24

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Quiz

Why must completed chips undergo thermal testing?

Jul 24

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BETA

steve Slice, Wrap, Zap!

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steve Dicing the wafer into individual dies

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steve The circular wafer is cut into tiny individual square pieces called dies using high-speed saws.

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Quiz

What material is most commonly used to seal and protect the final packaged chip?

Jul 24

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Quiz

How are logos and model numbers printed onto the final packaged chip?

Jul 24

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steve Chip Packaging and Testing

Spin the diamond blade, slice the silicon, wire it up and turn the power on.

Jul 24

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steve Packaging the delicate silicon for protection

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Packaging the delicate silicon for protection

steve The fragile silicon die is enclosed in a protective plastic or ceramic casing with electrical connectors.

Jul 24

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Quiz

At what speed does a typical dicing saw spin to cut silicon wafers?

Jul 24

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Quiz

What does a wafer prober do during the manufacturing process?

Jul 24

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Fun Fact

Gold connections: The microscopic wires connecting a chip die to its outer package are often made of pure gold.

Jul 24

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steve The final test before shipping to devices

Jul 24

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Quiz

What metal is frequently used for the tiny wire bonds connecting the silicon die to the package pins?

Jul 24

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Quiz

What happens to chips on a wafer that fail the initial probe test?

Jul 24

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Gossip

Do you prefer repairable electronics or sleek designs?

Jul 24